深圳LNP THERMOCOMP Lexan_SML5790
应用范围： 产品描述 LNP THERMOCOMP Lexan_SML5790物性表 Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
下载PDF
详细介绍
产品描述
深圳LNP THERMOCOMP Lexan_SML5790物性表
Nonhalogenated, 10% glass filled PC. Internal mold release. Thin-wall applications.
来源：http://sz.va-so.com/product827948.html
发布时间：2022/5/9 12:03:30
