深圳LNP THERMOCOMP EC006E

应用范围：　　产品描述　　LNP THERMOCOMP EC006E物性表　　LNP THERMOCOMP EC006E is a compound based on Polyetherimide resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Con

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　　产品描述

　　深圳LNP THERMOCOMP EC006E物性表

　　深圳LNP THERMOCOMP EC006E is a compound based on Polyetherimide resin containing 30% Carbon Fiber. Added features of this material include: Easy Molding, Electrically Conductive